For applications where a circuit board is being utilized to satisfy electronic design requirements, individual NEXSYS components can be provided as a Thru-hole device.
Part numbers are laser marked on the top of each component for easy identification after installation. Solderable pins (0.025" diameter) are designed to be compatible with 0.062” to 0.093” thick circuit boards.
The following NEXSYS components are available as a stand-alone Thru-hole device. See NEXSYS® Components for a complete description of the functionality of each component.
| NEXSYS® Components | |||
|---|---|---|---|
 |
ARINC Single-Bit Converter | Single label, Single-Bit ARINC 429 digitial-to-analog signal converter | SummaryDatasheet |
or  |
ARINC Multi-Bit Converter | Single label, Multi-Bit ARINC 429 digital-to-analog signal converter | SummaryDatasheet |
or |
ARINC Multi-Bit Binary Decoder | Single label, Multi-Bit ARINC 429 digital-to-analog binary decoder | SummaryDatasheet |
 |
Current Sensor | Undercurrent or overcurrent monitoring | SummaryDatasheet |
 |
Defined Logic | Boolean AND, OR, NOT (inverter) and Exclusive OR logic gates up to four inputs | SummaryDatasheet |
|
Diode Pack | Two independent diodes available in commercial or military configurations | SummaryDatasheet |
|
Electronic Latch | Electronic flip-flop to replace magnetic or solenoid switches | SummaryDatasheet |
|
Electronic Rotary | Pushbutton actuation to cycle through up to four latched states | SummaryDatasheet |
|
Pulse/Timer | Dual channel, edge detecting, one-shot pulse generator from 125 ms to 20 seconds | SummaryDatasheet |
|
Solid State Relay | Normally Open (up to 0.75 amps) or Normally Closed (up to 0.25 amps) | SummaryDatasheet |
|
Combination Solid State Relay | Four internally connected SPST switches, available in multiple Normally Open and Normally Closed configurations. | SummaryDatasheet |
|
Square Wave Oscillator | Output a signal that oscillates between Open and Ground at a specified rate | SummaryDatasheet |
|
Time Delay |
Output a delayed Ground or Open signal initiated after a specified input trigger event | SummaryDatasheet |
|
Voltage Sensor | Monitor DC under-volt or over-volt condition from 1 VDC to 48 VDC | SummaryDatasheet |
NEXSYS Thru-hole devices should be soldered to a rigid printed circuit board with thickness ranging from 0.062" - 0.093". Soldering on a flexible PCB is not recommended. Components are to be soldered to PCB per IPC J-STD-001G. The class used for soldering is per application requirements. Pins are thru-hole and not intended to be crimped.
