6.0
Component Series Pinout
Four Series designations, Series A, Series C, Series N, and Series R define the dimensions, packaging options and number of I/O of NEXSYS Components. Series A Pins are numbered 1-4, Series C and Series N are numbered 1-8 and Series R are numbered 1-12. The tables below correlate base pin numbers identified in each component section to the actual pin identification of each packaging form factor: NEXSYS Module, VIVISUN Body, and Thru-Hole Devices, see Figure 6.0.0.0-A – Figure 6.0.0.0-D.
The Part Configurator will prioritize the correct position of each component inside either a VIVISUN body or NEXSYS Module, and a pinout is provided at the time of part configuration. The pin identification is marked on the connector plug, except for Thru-Hole Devices since a connector is not used.
VIVISUN Compact Body
The VIVISUN Compact Body form factor, has two positions (Position A and B) and each position has the capacity to package one four-pin NEXSYS Component (i.e., Series A). The pin identification of VIVISUN Compact bodies is A1-A4 for Position A components and B1–B4 for Position B.
VIVISUN High-Capacity Body and NEXSYS Modules
The VIVISUN High-Capacity Body and NEXSYS Module form factor each have four positions (Position H, J, K and L), which afford the capacity to package a NEXSYS component of any Series. The pin identification of VIVISUN High-Capacity Bodies and NEXSYS Modules is H1–H4 for Position H, J1–J4 for Position J, K1–K4 for Position K, and L1–L4 for Position L. Series C, Series N, and Series R components are specified inside a VIVISUN High-Capacity Body (vs. Compact Body) due to the larger dimensions. Series A components occupy only one position, while Series C, Series N, and Series R occupy multiple positions. The VIVISUN High-Capacity Body affords packaging Series N or Series R components along with a Series A component, while the NEXSYS Module has capacity for, Series N or Series R components specified alone.
NEXSYS Thru-Hole Devices
The NEXSYS Thru-Hole Device form factor affords the use of stand-alone NEXSYS Components, primarily for Printed Circuit Board (PCB) applications. Thru-Hole pins are numbered 1-4, 1-8 or 1-12, matching the base pin numbers since there is no connector plug.
Series A Components
| Base Pin ID | Pin ID when used in a VIVISUN Compact Body (See 4.1.1) | Pin ID when used in a VIVISUN High Capacity Body (See 4.1.2) or NEXSYS Module (See 3.1) | Pin ID when used as a Thru-Hole Device (See 5.1) |
| 1 | A1 or B1 | H1 or J1 or K1 or L1 | 1 |
| 2 | A2 or B2 | H2 or J2 or K2 or L2 | 2 |
| 3 | A3 or B3 | H3 or J3 or K3 or L3 | 3 |
| 4 | A4 or B4 | H4 or J4 or K4 or L4 | 4 |
Series C Components
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Figure 6.0.0.0-B |
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|---|---|---|---|
| Base Pin ID | Pin ID when One (1) Series C component is used in a VIVISUN High Capacity Body (See 4.1.2) or NEXSYS Module (See 3.1) | Pin ID when Two (2) Series C components are used in a NEXSYS Module (See 3.1) | Pin ID when used as a Thru-hole Device (See 5.1) |
| 1 | J1 | H1 or K1 | 1 |
| 2 | J2 | H2 or K2 | 2 |
| 3 | J3 | H3 or K3 | 3 |
| 4 | J4 | H4 or K4 | 4 |
| 5 | K1 | J1 or L1 | 5 |
| 6 | K2 | J2 or L2 | 6 |
| 7 | K3 | J3 or L3 | 7 |
| 8 | K4 | J4 or L4 | 8 |
Series N Components
| Base Pin ID | Pin ID when used in a VIVISUN High Capacity Body (See 4.1.2) or NEXSYS Module (See 3.1) | Pin ID when used as a Thru-hole Device (See 5.1) |
| 1 | J1 | 1 |
| 2 | J2 | 2 |
| 3 | J3 | 3 |
| 4 | J4 | 4 |
| 5 | K1 | 5 |
| 6 | K2 | 6 |
| 7 | K3 | 7 |
| 8 | K4 | 8 |
Series R Components
| Base Pin ID | Pin ID when used in a VIVISUN High Capacity Body (See 4.1.2) or NEXSYS Module (See 3.1) | Pin ID when used as a Thru-hole Device (See 5.1) |
| 1 | J1 | 1 |
| 2 | J2 | 2 |
| 3 | J3 | 3 |
| 4 | J4 | 4 |
| 5 | K1 | 5 |
| 6 | K2 | 6 |
| 7 | K3 | 7 |
| 8 | K4 | 8 |
| 9 | L1 | 9 |
| 10 | L2 | 10 |
| 11 | L3 | 11 |
| 12 | L4 | 12 |