5.1
Each Component Series (Series A, Series C, Series N, and Series R) has specific external component dimensions and pin spacing. All of the Thru-hole devices use a 0.025” diameter pin for thru-hole soldering.
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Figure 5.1.0.0-A Series A |
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Figure 5.1.0.0-B Series C |
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Figure 5.1.0.0-C Series N |
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Figure 5.1.0.0-D Series R |
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Operating Parameters
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Figure 5.1.0.0-E |
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| Description | Parameters |
| Physical | |
| Weight |
Series A: 3.0 grams (0.1 ounces) max. Series C: 4.5 grams (0.2 ounces) max. Series N: 8.5 grams (0.3 ounces) max. Series R: 8.5 grams (0.3 ounces) max. |
| Materials | Housing (Carbon Epoxy) |
| Environmental | |
| Temperature | Operating/Non-operating -55C to +85C |
| Altitude | -15,000 to +55,000 ft |
| Salt and Humidity | Humidity: 240 hrs, Salt: 96 hrs |
| Shock | 20 G Sawtooth, 75 G half-sine |
| Vibration | 10 to 2000 Hz 15 G |
| Electrical and Functional Performance | |
| See the Qualification Table (Appendix A) for electrical performance of each solderable component. Testing meets or exceeds the defined levels for RTCA/DO-160, MIL-STD-202 and MIL-STD-810. | |